Gaming PC (tower)

Gaming PC towers are desktop computer systems designed for high-performance computing applications including video games, content creation, and computational tasks. The Climate Cost Index score reflects the embodied carbon emissions from manufacturing a complete tower unit weighing approximately 10.8 kilograms.

Material Composition Assumptions

The material breakdown for a typical gaming PC tower includes six primary component categories. The steel chassis forms the structural foundation at 4,320 grams representing 40% of total weight. Plastic components including ABS and polycarbonate panels contribute 2,700 grams or 25% of the unit mass. Aluminum heat sinks and thermal management components account for 1,620 grams at 15% of total weight. Copper wiring throughout the system totals 1,080 grams representing 10% of the product mass. Printed circuit boards and semiconductor components constitute 540 grams or 5% of weight despite their high carbon intensity. Additional materials including fasteners, cables, and miscellaneous components make up the remaining 540 grams at 5% of total mass.

Manufacturing Geography

Primary production occurs across China, Southeast Asia, and Taiwan, with China responsible for 55% of global electronics manufacturing. The baseline grid intensity of 560 gCO2e per kilowatt-hour reflects China’s electricity system, which has decreased 4.1% from the previous year but remains significantly above the global average of 473 gCO2e per kilowatt-hour. This manufacturing concentration results from established supply chains, semiconductor fabrication facilities, and metalworking capabilities in the region.

Regional Variation

Manufacturing location substantially affects the carbon intensity due to varying electricity grid compositions across regions.

Manufacturing Region	Grid Intensity	Estimated CCI Score	Adjustment vs Default
Europe (renewable grid)	213 gCO2/kWh	365	-25%
United States	369 gCO2/kWh	425	-12%
India	708 gCO2/kWh	565	+16%
Southeast Asia	650 gCO2/kWh	535	+10%
Japan/South Korea	450 gCO2/kWh	455	-6%

Provenance Override Guidance

Suppliers can submit specific data to replace default assumptions and achieve more accurate carbon accounting:

1. Manufacturing facility electricity consumption records with renewable energy certificates or power purchase agreements
2. Primary material sourcing documentation including steel grade specifications, aluminum recycled content percentages, and plastic resin origins
3. Component-level production data for graphics processing units, central processing units, and other semiconductor elements
4. Transportation logistics including shipping distances, freight modes, and packaging material specifications
5. Facility-specific process energy requirements for computer numerical control machining, printed circuit board assembly, and quality testing operations

Methodology Notes

• The CCI score represents cradle-to-gate embodied carbon emissions through the point of factory completion, excluding use phase electricity consumption and end-of-life processing
• Scope 1 emissions at 340 kg CO2e include direct industrial processes for steel production, aluminum smelting, and chemical manufacturing for plastic components
• Scope 2 emissions at 125 kg CO2e reflect electricity consumption during semiconductor fabrication, metalworking operations, and final assembly procedures
• Scope 3 emissions at 20 kg CO2e account for raw material transportation and component logistics within the supply chain
• The functional unit is one complete gaming PC tower system ready for retail distribution
• Excluded elements include packaging materials, retail distribution, consumer transportation, operational electricity, maintenance, and disposal activities
• Data gaps exist for emerging semiconductor technologies, specialized cooling systems, and region-specific manufacturing process variations