Mechanical Keyboard

Material Composition Assumptions

This assessment assumes a standard mechanical keyboard weighing 1.0 kg total. The material breakdown reflects typical construction patterns observed in e-waste analysis and manufacturer specifications.

The housing and keycaps comprise 650g (65%) of the total weight, constructed primarily from acrylonitrile butadiene styrene thermoplastic. This polymer dominates keyboard waste streams and provides the structural foundation for most consumer models.

Electronic components including the printed circuit board, microcontroller, and associated circuitry account for 180g (18%) of the device weight. These components require semiconductor fabrication processes with high energy intensity during production.

Mechanical switches contribute 120g (12%) to the overall mass. Each switch contains plastic housing, metal contacts, and spring mechanisms, with typical keyboards incorporating 87 to 104 individual switch units.

The remaining 50g (5%) consists of metal structural elements including the mounting plate, stabilizer wire components, and internal frame reinforcement that provides typing stability and durability.

Manufacturing Geography

Production occurs predominantly in China, Taiwan, and Vietnam, reflecting the established electronics manufacturing infrastructure in East and Southeast Asia. These regions host integrated supply chains spanning plastic molding, semiconductor fabrication, and final assembly operations.

The carbon intensity calculation uses China’s national grid average of 621 gCO2e/kWh, representing the dominant manufacturing location for consumer electronics globally. This grid intensity reflects the coal-heavy electricity generation mix that powers most keyboard production facilities.

Manufacturing concentration in these regions stems from proximity to raw material suppliers, established logistics networks, and specialized technical expertise in high-volume electronics production.

Regional Variation

Manufacturing Region	Grid Intensity	Estimated CCI Score	Adjustment vs Default
Germany	485 gCO2e/kWh	16	-11%
United States	425 gCO2e/kWh	15	-17%
Taiwan	554 gCO2e/kWh	17	-6%
India	708 gCO2e/kWh	20	+11%
Vietnam	635 gCO2e/kWh	18	+2%

Provenance Override Guidance

1. Submit detailed bill of materials with specific plastic grades, PCB specifications, and switch quantities used in the actual product design rather than generic assumptions.

2. Provide manufacturing facility location data including the specific province or state where assembly occurs, enabling more precise grid intensity calculations.

3. Supply plastic injection molding energy consumption records and semiconductor component sourcing documentation with associated carbon footprint data from chip manufacturers.

4. Document any recycled content percentages in housing materials, particularly post-consumer ABS plastic incorporation that reduces virgin material requirements.

5. Furnish transportation distance data from component suppliers to final assembly location, along with shipping method specifications for primary logistics routes.

Methodology Notes

• This CCI score represents cradle-to-gate embodied carbon covering raw material extraction through completed manufacturing, excluding use phase and end-of-life treatment
• Scope 1 emissions dominate at 15.8 kg CO2e due to energy-intensive plastic production and semiconductor fabrication processes
• Scope 2 contributions of 1.4 kg CO2e reflect electricity consumption during assembly and testing operations
• The functional unit assumes a single mechanical keyboard with standard layout and construction materials
• Transportation beyond the manufacturing region boundary is excluded from this assessment
• Data gaps exist around specific switch manufacturer emissions and regional variation in plastic production carbon intensity