Wireless Mouse

Material Composition Assumptions

The CCI score assumes a standard wireless mouse weighing 70 grams with the following material breakdown:

• ABS plastic housing: 32 grams (46% of total weight) forming the outer shell and internal structural components
• Electronic components: 15 grams (21%) including semiconductor integrated circuits, sensors, and wireless transmission modules
• Printed circuit board: 8 grams (11%) providing electrical connections between components
• Battery: 10 grams (14%) typically lithium-based rechargeable or alkaline disposable cells
• Other materials: 5 grams (7%) consisting of internal cables, metal screws, and small mechanical parts

The plastic housing dominates the physical mass but semiconductor components drive the majority of manufacturing emissions despite representing less than one-quarter of the total device weight.

Manufacturing Geography

The default CCI score reflects production primarily in China with secondary manufacturing in Taiwan and Malaysia, representing the actual geographic distribution of global wireless mouse production. China accounts for approximately 65% of global production volume, Taiwan handles 20% focused on high-tech components, Malaysia contributes 10%, and South Korea provides 5%.

These regions experience grid intensities ranging from 500 to 650 gCO2e per kilowatt-hour, with the weighted average of 565 gCO2e/kWh applied to the CCI calculation. The energy-intensive nature of semiconductor fabrication and plastic injection molding makes grid intensity a critical factor in determining the final carbon footprint.

Regional Variation

Manufacturing Region	Grid Intensity	Estimated CCI Score	Adjustment vs Default
Taiwan	500 gCO2e/kWh	3.6	-10%
Malaysia	650 gCO2e/kWh	4.2	+5%
South Korea	480 gCO2e/kWh	3.5	-12%
European manufacturing	290 gCO2e/kWh	2.8	-30%
Coal-heavy regions	780 gCO2e/kWh	4.8	+20%

Provenance Override Guidance

Suppliers can provide the following data types to override the default CCI score with product-specific calculations:

1. Manufacturing location with specific facility addresses to determine accurate regional grid intensity factors
2. Material composition breakdown by weight showing actual plastic types, electronic component specifications, and battery chemistry
3. Primary material supplier locations for ABS plastic resin, semiconductor components, and printed circuit boards
4. Production energy consumption data from injection molding, assembly operations, and testing procedures
5. Transportation modes and distances from component suppliers to final assembly facilities

Methodology Notes

• The CCI score represents cradle-to-gate emissions including raw material extraction through final product assembly but excluding use phase and end-of-life disposal
• Scope 2 emissions dominate due to energy-intensive plastic injection molding and final assembly operations in regions with carbon-intensive electricity grids
• Scope 3 emissions reflect upstream semiconductor manufacturing and printed circuit board fabrication processes
• The functional unit is one complete wireless mouse device ready for retail distribution
• Packaging materials, retail distribution, and consumer use phase charging emissions are excluded from the boundary
• Data gaps exist around rare earth element mining for electronic components and detailed supply chain transportation distances