Laptops & Computers

Electronics
High Confidence

Carbon Cost Index Score

400 kgCO₂e / per unit

Per kg

200 kgCO₂e / kg

Methodology v1.0 · Last reviewed 2026-04-07

Scope Breakdown

Scope kgCO₂e % of Total Distribution
Scope 1 4 1%
Scope 2 60 15%
Scope 3 336 84%
Total 400 100%

Emission Hotspots

Emission Hotspot Scope Est. % of Total
Motherboard, CPU, GPU, and semiconductor fabrication S3 38%
Chassis (aluminum/magnesium), SSD, and memory modules S3 20%
Display panel (LCD/OLED) and backlight manufacturing S3 16%
Final assembly, test, packaging, and distribution S2 16%
Battery pack and power delivery components S3 10%

Manufacturing Geography

Region
China (primary), Taiwan, South Korea
Grid Intensity
565 gCO2e/kWh (IEA 2024, China average)

Material Composition Assumptions

The default bill of materials for a representative laptop (approximately 2.0 kg) includes:

The motherboard (including CPU/GPU silicon) represents only ~10% of total mass but accounts for roughly 38% of embodied carbon due to energy-intensive semiconductor fabrication.

Manufacturing Geography

The default manufacturing region is China, with semiconductor fabrication in Taiwan (TSMC) and South Korea (Samsung Foundry, SK Hynix).

Regional Variation

RegionGrid IntensityEstimated Score Adjustment
EU average~300 gCO2e/kWh-47% on Scope 2 (saves ~28 kgCO2e)
USA average~390 gCO2e/kWh-31% on Scope 2 (saves ~19 kgCO2e)
Taiwan~500 gCO2e/kWh-12% on Scope 2 (saves ~7 kgCO2e)
India~700 gCO2e/kWh+24% on Scope 2 (adds ~14 kgCO2e)
Nordic (Sweden/Norway)~30 gCO2e/kWh-95% on Scope 2 (saves ~57 kgCO2e)

Note: Scope 2 represents ~15% of the total footprint. The majority of the carbon impact is in Scope 3 upstream emissions (84%), so grid region variation has a meaningful but not transformative effect on the total score.

Provenance Override Guidance

A supplier or manufacturer may override the default CCI score by submitting:

  1. Product Carbon Footprint (PCF) report aligned with ISO 14067, PAS 2050, or IEC 62921 (PAIA methodology), certified by a third-party verifier.
  2. Configuration-specific data including exact CPU/GPU TDP, display size and type, battery capacity, and memory/storage specifications, since these drive significant variance in embodied emissions.
  3. Factory energy sourcing documentation such as renewable energy certificates, PPA contracts, or energy attribute certificates for assembly and component manufacturing facilities.
  4. Use-phase power consumption data based on ENERGY STAR or EU Energy Label testing for the specific model.

Dell, HP, and Lenovo all publish model-level PCF data that qualifies as valid provenance overrides. Apple publishes Product Environmental Reports for all MacBook models.

Methodology Notes

Product Deep Dives

Related Concepts

Related Categories

Sources

  1. Dell Inc. — Carbon Footprint of a Typical Business Laptop, Dell whitepaper. Reports 300-400 kgCO2e per laptop over a 4-year lifetime.
  2. HP Inc. — Product Carbon Footprint Reports (2024). HP 14 Laptop PCF report (Jan 2024); HP 17 Laptop estimated impact 180-670 kgCO2e depending on configuration.
  3. Circular Computing / Rarecoil — Analysis of 230 laptop models found an average carbon footprint of 331 kgCO2e for production. Manufacturing accounts for 75-85% of lifecycle emissions.
  4. Lenovo — Product Carbon Footprint Information Sheets using PAIA methodology aligned with IEC 62921. Published for all new products since July 2015.
  5. IEA — Emissions Factors 2024. China grid intensity 565 gCO2/kWh (2024); Taiwan ~500 gCO2/kWh.
  6. Teehan & Kandlikar (2013) — Comparing Embodied Greenhouse Gas Emissions of Modern Computing and Electronics Products. Environmental Science & Technology. Found 27-39 kgCO2e per kg of ICT product.
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