Networking Equipment (Routers, Modems)

Electronics
Low Confidence

Carbon Cost Index Score

20 kgCO₂e / per unit

Per kg

33 kgCO₂e / kg

Methodology v1.0 · Last reviewed 2026-04-07

Scope Breakdown

Scope kgCO₂e % of Total Distribution
Scope 1 0.3 2%
Scope 2 5.7 29%
Scope 3 14 70%
Total 20 100%

Emission Hotspots

Emission Hotspot Scope Est. % of Total
Semiconductor ICs (SoC, Wi-Fi chipset, switch fabric) S3 35%
PCB fabrication and SMT assembly S2 22%
Plastic housing and metal heat sinks (injection molding, die casting) S3 15%
Power supply unit (AC adapter or internal PSU) S3 14%
Testing, packaging, and transport S3 14%

Manufacturing Geography

Region
China, Taiwan, Vietnam
Grid Intensity
565 gCO2e/kWh (IEA 2024, China)

Material Composition Assumptions

The default reference product is a consumer Wi-Fi router (Wi-Fi 6 class) weighing approximately 0.6 kg, composed of:

Consumer routers are relatively simple electronics products compared to smartphones or laptops, but the semiconductor content (Wi-Fi SoC, memory) still drives a significant portion of embodied emissions due to the high energy intensity of wafer fabrication.

Manufacturing Geography

Consumer networking equipment manufacturing is concentrated in East and Southeast Asia:

Regional Variation

Manufacturing RegionGrid IntensityEstimated CCI ScoreAdjustment vs Default
China (default)~565 gCO2e/kWh20 kgCO2eBaseline
Taiwan~510 gCO2e/kWh19 kgCO2e-5%
Vietnam~480 gCO2e/kWh18.5 kgCO2e-8%
USA (hypothetical)~390 gCO2e/kWh17 kgCO2e-15%
EU average~300 gCO2e/kWh16 kgCO2e-20%

Note: Scope 3 dominates at 70%, so grid variation affects primarily the 29% Scope 2 component.

Provenance Override Guidance

A supplier or brand may override the default CCI score by submitting:

  1. Product Carbon Footprint (PCF) per ISO 14067 covering components through packaged device.
  2. Semiconductor sourcing data: Wafer foundry and packaging facility emissions data.
  3. Factory energy data: Assembly facility renewable energy procurement (PPAs, RECs/GOs).
  4. Product-level LCA: Cisco and some enterprise vendors publish product lifecycle data that can serve as reference for consumer-grade equivalents.

Methodology Notes

Related Concepts

Related Categories

Sources

  1. Malmodin & Lundén (2018) — The Energy and Carbon Footprint of the Global ICT and E&M Sectors 2010-2015. Sustainability, 10(9), 3027. Provides sector-level emissions data for networking and telecommunications equipment production.
  2. Cisco (2023) — Cisco ESG Reporting Hub: Product sustainability data. Reports lifecycle carbon footprint data for selected router and switch products, with production-phase estimates in the range of 15-50 kgCO2e depending on product class.
  3. EPA USEEIO (2020) — US Environmentally-Extended Input-Output Model v2.0. Sector 'Communication equipment manufacturing' (NAICS 334210). Provides economy-wide emissions intensity benchmarks for networking hardware.
  4. Andrae & Edler (2015) — On Global Electricity Usage of Communication Technology: Trends to 2030. Challenges, 6(1), 117-157. Provides context on the manufacturing energy footprint of ICT equipment.
  5. IEA (2024) — Emissions Factors 2024. Grid carbon intensities: China 565, Taiwan 510, Vietnam 480 gCO2e/kWh.
Scan a product in this category →