Tablets
Electronics High Confidence
Carbon Cost Index Score
70 kgCO₂e / per unit
Per kg
140 kgCO₂e / kg
Methodology v1.0 · Last reviewed 2026-04-07
Scope Breakdown
| Scope | kgCO₂e | % of Total | Distribution |
|---|---|---|---|
| Scope 1 | 1 | 1% | |
| Scope 2 | 19 | 27% | |
| Scope 3 | 50 | 71% | |
| Total | 70 | 100% |
Emission Hotspots
| Emission Hotspot | Scope | Est. % of Total |
|---|---|---|
| Display panel production (LCD/OLED, clean room fab) | S3 | 30% |
| Semiconductor ICs (SoC, memory, NAND flash wafer fab) | S3 | 28% |
| PCB assembly and final device assembly | S2 | 18% |
| Lithium-ion battery cell production | S3 | 15% |
| Aluminum/magnesium enclosure and packaging | S3 | 9% |
Manufacturing Geography
- Region
- China (primary), South Korea, Vietnam
- Grid Intensity
- 565 gCO2e/kWh (IEA 2024, China)
Material Composition Assumptions
The default reference product is a 10-11 inch tablet weighing approximately 0.5 kg, composed of:
- Display module: LCD or OLED panel with cover glass (typically alumino-silicate), touch digitizer, and backlight (LCD only), approximately 0.15-0.18 kg. Display manufacturing involves clean-room photolithography similar to TV panels but at smaller substrate sizes.
- Semiconductor ICs: System-on-chip (SoC), DRAM (4-8 GB), NAND flash storage (64-256 GB), power management IC, and various controllers, approximately 10-15 g total. Wafer fabrication at 5-7 nm process nodes is extremely energy-intensive.
- Lithium-ion battery: Lithium polymer pouch cell, approximately 0.12-0.15 kg (25-35 Wh capacity). Battery constitutes roughly 25-30% of device mass.
- Enclosure: Aluminum unibody or magnesium alloy rear shell, approximately 0.12-0.15 kg. CNC-machined from billet aluminum with anodized finish.
- PCBs and connectors: Multi-layer HDI printed circuit boards with surface-mount components, approximately 0.02-0.03 kg.
- Packaging: Cardboard box, charger (if included), cable, and documentation, approximately 0.3-0.5 kg.
Manufacturing Geography
Tablet manufacturing follows the broader consumer electronics supply chain:
- Component production: Display panels from China (BOE, Tianma) or South Korea (Samsung, LG); semiconductors from Taiwan (TSMC) and South Korea (Samsung); batteries from China (ATL, BYD).
- Final assembly: Primarily China (Foxconn, Pegatron, Compal facilities in Shenzhen, Zhengzhou, Chengdu).
- Grid intensity (China): 565 gCO2e/kWh (IEA 2024). Used as conservative default since the majority of assembly and many components originate in China.
- Grid intensity (South Korea): 430 gCO2e/kWh (IEA 2024). For Samsung-specific production.
- Grid intensity (Taiwan): 510 gCO2e/kWh (IEA 2024). TSMC wafer fabs.
- Rationale: Semiconductor fabrication and display panel manufacturing are the most energy-intensive steps. A single wafer fab can consume 50-100 MW continuously.
Regional Variation
| Assembly + Component Region | Grid Intensity | Estimated CCI Score | Adjustment vs Default |
|---|---|---|---|
| China (default) | ~565 gCO2e/kWh | 70 kgCO2e | Baseline |
| South Korea | ~430 gCO2e/kWh | 63 kgCO2e | -10% |
| Taiwan (TSMC supply) | ~510 gCO2e/kWh | 67 kgCO2e | -4% |
| Vietnam (assembly only) | ~480 gCO2e/kWh | 66 kgCO2e | -6% |
| USA (hypothetical) | ~390 gCO2e/kWh | 60 kgCO2e | -14% |
Note: Scope 2 is 27% of total emissions. Component origin (especially display and semiconductor fabs) matters more than final assembly location for total emissions.
Provenance Override Guidance
A supplier or brand may override the default CCI score by submitting:
- Product Environmental Report or Product Carbon Footprint (PCF) per ISO 14067. Apple, Samsung, and Microsoft publish detailed product-level reports.
- Component-level data: Display panel supplier PCF, semiconductor foundry emissions data (TSMC publishes per-wafer emissions), battery cell supplier data.
- Factory energy data: Renewable energy procurement at assembly and component facilities. Apple’s supplier clean energy program is a reference example.
- Recycled content data: Recycled aluminum enclosures can reduce enclosure-stage emissions by 80-90% vs. primary aluminum.
Methodology Notes
- CCI score of 70 kgCO2e represents a conservative estimate for a 10-11 inch tablet. Apple reports 53-69 kgCO2e for iPad Air models (with Apple’s partially decarbonized supply chain); the CCI score adds a conservative margin for non-optimized supply chains with coal-intensive grids.
- Scope breakdown: Scope 3 dominates at 71% (50 kgCO2e), driven by display panel manufacturing, semiconductor IC production, battery cell manufacturing, and aluminum enclosure production at upstream suppliers. Scope 2 is 27% (19 kgCO2e) from final assembly and testing electricity. Scope 1 is 2% (1.0 kgCO2e).
- Confidence: High because multiple manufacturers (Apple, Samsung, Microsoft) publish detailed product environmental reports with independently verified data.
- Functional unit: One 10-11 inch tablet (~0.5 kg), cradle to gate through packaged product.
- Use-phase: Excluded but relatively modest. A tablet consuming 10-15 kWh/year over 4 years contributes approximately 15-30 kgCO2e in use-phase emissions.
- Size scaling: Larger tablets (12-13 inch) have approximately 30-50% higher production emissions due to larger display panels and batteries.
Related Concepts
Related Categories
Sources
- Apple (2024) — Product Environmental Reports for iPad Air (M2) and iPad Pro (M4). Reports production-phase emissions of 53-69 kgCO2e for 11-inch models and 78-97 kgCO2e for 13-inch models, with production accounting for 77-83% of lifecycle emissions.
- Hischier & Baudin (2010) — LCA study of a plasma television device. International Journal of Life Cycle Assessment, 15, 428-438. Provides reference data on display panel manufacturing emissions applicable to tablet-scale panels.
- Prakash et al. (2016) — Influence of product lifetime on environmental impact. UBA-Texte 11/2016. German Federal Environment Agency. Contains comparative LCA data for tablets and other consumer electronics.
- Boyd (2012) — Semiconductor Manufacturing Energy Considerations. In Sustainable Manufacturing. Springer. Quantifies energy intensity of wafer fabrication at approximately 1-2 kWh per cm2 of processed wafer area.
- IEA (2024) — Emissions Factors 2024. Grid carbon intensities: China 565, South Korea 430, Taiwan 510 gCO2e/kWh.